Hey Ebecheto: We currently have a script that saves the pad information to a file that can then be used in Allegro to create the footprint. I'm trying to streamline this process so Allegro doesn't have to be opened to put a footprint in the library. In our case we put flip chip and wire bonded die directly on a multi-chip module (small pcb) so our die do not have their own package. The whole module is packaged. Here we are just interested in getting the footprint and pad locations of the die in Allegro format. -Curtis
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