Thermally relieve the discretes, so that the GND pads actually show. (e.g. tie the pads to GND with a large copper trace, essentially 'pouring' them as you've done historically) That way the fab shop sees a pad on each side of the discrete and opens the soldermask equally on both sides. Your problem should go away, with little changes to your process. Thermally relieving the GND pad should not affect any performance.
↧