Hi Ray, There is no need to manually enter tool information. It looks to me your issue pertains to not using "Enhanced Excellon" format when creating your tooling info. Try the following. Go to the NC ROUTE and click on the Parameters button. In that panel enable by checking the following Leading Zero Suppression. Enhanced Excellon Format. Automatically create drill ncroutebits_auto. When you generate your Route file allegro will assign a tool for the slot. Within the folder where the route file is located there will be also a log so you can see what the program did. Give that a try and see if it works for you. Best Regards.
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Forum Post: RE: NC Route file doesn't include hole/drill size
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Forum Post: RE: ERROR (SFE-874). Not able to resolve this issue
There are several problems: If you are directly running "spectre dyn_floating_node.scs" then the first line is treated as the "title" line (a common convention that SPICE always had). Because of this, the very first line is ignored and so that means it's missing the dyn_float_tran_stat check and just getting the parameters (which is why it complains about the equals) The domains parameter should be specified as a vector (i.e. surrounded by []) The line with ping_start defined (your line 4) is omitting the continuation escape (backslash) at the end of the line All your vectors in the file have been escaped - you have \[...\] instead of [...]. Why? I wondered whether maybe you were using a stimulus file in ADE (which does some name translation) - my recommendation if you were doing this would be to use a definition file in ADE instead as this does not do any mapping and allows you to enter directly in Spectre syntax. I corrected all of these, and then it runs OK. The start of the file looks like this: // my title myfnccheck dyn_float_tran_stat \ domains = [VDD00 AGND] \ ping_count = 300 \ ping_start = [20u] \ ping_duration =10u \ ping_resistor_min =10M \ ping_resistor_max =10G \ seed =1154 \ save =ping \ ping_ibias=100n \ ping_iabsthresh =500n \ ping_iabsthresh_ramp =1u \ ping_irelthresh =10000 \ xsubckt = [V5ISO_SVT_TIELC V5ISO_SVT_TIELC] //* Andrew
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Forum Post: RE: Unified Search (M): Bad request Source for Samacsys
This issue is known to us and have been reported, we will update you once the issue gets fixed.
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Forum Post: RE: Unified Search (M): Bad request Source for Samacsys
thak you. Just for other people interested, reinstalling or upgrading to SP002 does not solve the issue.
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Forum Post: RE: metal pin in layout is showing its actual color
Andrew Beckett can you please help me with the same.
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Forum Post: RE: metal pin in layout is showing its actual color
OK, hopefully you resolved the permissions issues we discussed before. Anyway, the first thing to do is to use Tools→Technology File Manager to dump the tech file from tsmcN65 into (say) tsmcN65.tf. Then look in this file for the techDisplays section. This lists the layer/purpose pairs and the packet, visibility, selectability and various other attributes. I have a rather old tsmcN65 PDK to hand, and in this technology file the packets are named: ( M1 pin cyanXthickLine2 t t t t t ) ( M2 pin goldXthickLine2 t t t t t ) ( M3 pin forestXthickLine2 t t t t t ) ( M4 pin slateXthickLine2 t t t t t ) Then these are defined in the display.drf at the same location as the tsmcN65 library. Can you check that display.drf to see if whatever packets you have referenced from the tech file are defined in the display.drf which comes with the PDK? My guess is that you have a local display.drf which is from a different technology and hence the packet names don't align with what they are called in the PDK. Otherwise if they were matching they wouldn't show up in yellow (it's probably complaining about missing packets when you open the layout?) Andrew
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Forum Post: Alternate parts on BOMs
Greetings, In my database, I have a part that could be any number of matching parts. i have a single part now but would like to add additional parts from alternate manufacturers. The main part might be a 10K resistor made by Vishay. Other direct replacements could be from Panasonic, Samsung, etc. I would like my BOM to include all parts I might add to the database. Is this possible? If yes, how would I set that up? Thank you! Best regards, Fred
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Forum Post: RE: Scaled Assembly Drawing with Filled Pads and Non-Vectorized Text
Thanks, David! Tried to use the script, but then I realized that when I export and then import plot file (IPF), all pads turn into a "Figure" as a DRAWING FORMAT. I am not able to find a way to fill "Figure" objects in Allegro. Do you know if there is a way to fill "Figures"? I can then modify the script for it.
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Forum Post: RE: Alternate parts on BOMs
I think Capture CIS by itself is not designed to support "equivalents" as individual records as we call them. If you use EMA's Component Information Portal, alternate equivalents are added by importing the CIS BOM into the CIP web interface. A second option is to configure multiple manufacturers/MPN properties in the database and CIS. Distributor part numbers? I don't believe Operations ever used those. They were thrilled when I include OctoPart URLs with each MPN. First question they have is if stock is at a distributor or do we have to use a broker in China. O_o
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Forum Post: CadenceLive 2025: The Field Guide for Defense Digital Engineering
Modern microelectronics is a new operating theater for many in the Defense Industrial Base (DIB). It’s no longer a question of if, but how, to modernize. CadenceLive is replete with technical papers and keynote vision that form the field guide the DIB needs to boldly move forward. While the full agenda has many worthy technical papers, I’ve used my experience as a principle investigator on multiple Defense programs to assembled this handy field guide to CadenceLive 2025. 0800 – 0900: Register, network, and carbo-load. It’s going to be a high-energy day. 0900 – 1100: Can’t-miss keynotes! Fireside chat with nVidia CEO Jensen Huang and Cadence CEO Anirudh Devgan Keynotes from Cadence’s CEO Anirudh Devgan and Google AI’s Uri Frank. Expect to hear unique insights into how AI is transforming electronics development and more. 1115 – 1145 (Room M3) Raytheon: how Stratus high level synthesis is speeding algorithmic development of FPGA and ASIC systems for the DoD (Room 212) Secure-IC: how trust can be assured in chiplet-based design 1145 – 1215 (Room M3) GlobalFoundries: Optimizing aging effects using Liberate and Tempus in an advanced aging flow (Room G) Boeing: applying multi-physics analysis for validating and mitigating thermal effects in PCB design (Room 210) AFRL: applying digital engineering techniques to microelectronics designs 1215 – 1345: Lunch and chase speakers, sponsors, and peers for 1:1 discussions. Start with “tell me about your technology.” That’s the #1 best ice breaker with engineers. The carbs from the morning will help you keep up once they get going. 1345 – 1415: (Room M3) AFRL: Bridging the MBSE to implementation gap (I’m a co-author ) (Room M4) Cycuity+ADI: Assuring comprehensive functional and security coverage (uh-oh, I’m a co-author on this one too ) (Room Great America 3) Intel: Applying Cerebrus AI to enhancing power performance and area (PPA) 1415 – 1445: (Room B4) Cadence: System design and use cases of AI-driven DSP technologies (Room 210) ADI: Pre-silicon power estimation and profiling using Palladium Dynamic Power Analysis 1445 – 1515: (Room 204) InPlay: RF/AMS circuit foundry porting and optimization for modernization (Room 205) GlobalFoundries: 45SPCLO silicon photonics reference flow for 4x4 optical switch (Room G) Teradyne: Revolutionizing signal integrity optimization with AI/ML technology for high-speed channel breakout 1515 – 1600: Relax, network, recharge, and get ready for… 1600 – 1630: Another can’t miss fireside chat! Intel CEO Lip Bu Tan and Cadence CEO Anirudh Devgan 1645 – 1715: (Room 204) NASA JPL: Co-sim of polar and mid-latitude Mars subsurface ice and ultra-wideband Radar for the Mars Science Helicopter (if you want to find me at 1645, this is where I’ll be #spacegeek) (Room 207) Celus: Translating ideas into complete BOMs and outputs with AI (could help where we have incomplete technical data packages – TDPs) 1715 – 1745: (Room B4) TI: Midas Safety Platform enables FMEDA automation throughout functional safety lifecycle (Room 210) Cadence: Broadening adoption of HW-assisted verification with next-generation emulation appliance (stay for this one, it will be interesting!) My recommendation is to plan ahead because this CadenceLive has a great set of technical briefs for Defense attendees. I’m looking forward to seeing you all there! =Adam Sherer, Account Technical Director, Cadence Design Systems
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Forum Post: RE: Alternate parts on BOMs
The big need came with all the part shortages in the last few years. We didn't pay enough attention to the database. Now it is catch up time. For the same CIS Part Number: I can add alternate distributors for the same part (E.g., Digikey and Mouser) and addition distributor part number for the same part. I can also add additional parts for the same CIS Part Number (E.g., Panasonic and Vishay). Now this is the odd part. I went through for one of our small count PCBs; 54 parts with many multiples of the same part. In CIS, I replaced obsolete parts with active parts. These updated parts have no distributor name or part number on the BOM even though they are in CIS. The still active parts that I did not need to update, are in the the BOM. If there are two distributors, that data is there too. A quick test of 1 part with alternates has no distributor data either. I am baffled! Best regards, Fred
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Forum Post: RE: Alternate parts on BOMs
Are you using Component Information Portal to manage your parts database? If you are missing part data, are you able to Update Part Status All in CIS Part Manager without any issues? CIS supports CIS PNs linked to a number of equivalent MPNs. But, CIS will only export the first SQL record it finds. EMA-EDA/CIP had to implement importing a list of CIS PNs/REFDES instances to re-create a new BOM spreadsheet with all equivalents. I don't believe we can get that from CIS directly.
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Forum Post: RE: Python based scripting on Cadence SPB
Hi andakConsultingLtd , ok, Thanks for response
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Forum Post: RE: Python based scripting on Cadence SPB
Any Cadence employee in this forum, can you please reply ?
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Forum Post: Post processing LES vs RANS
Which post processing tool is recommended for comparing LES (made using CharLES), RANS and wind tunnel oil flow visualization results to each other?
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Forum Post: RE: Creating Parts
Hi. In Orcad CIS it is possible to create new symbols/Parts locally, however these parts will not be in the CIS database. I cant really see your picture so I don't know for sure if you are using the CIS Database or not. To test this open a schematic and on the tool bar click place database part. If CIS is configured you should see a new window pop up with the parts in your database. If this does not work it could be that your database is on a remote PC and you need permissions to access the database or CIS is not configured at all. The more immediate option would be to create symbols/parts locally instead. The easy way is to do this is to open one of the preinstalled capture libraries under your cadence folder and just add a new symbol to it or modify an existing one and save it out. You could also create a new library and create parts from scratch. To do this open capture and choose File > New Library. The library files in capture have a .olb extension when saved and should reside locally on your pc within the folder you saved them to. To add new parts to the database you would need a tool so as to edit the database tables. There is an optional product called CIP which allows adding new parts to the database. There are other methods too if the actual database was based on something like an excel spreadsheet or access database. Probably the first thing would be to determine if the CIS Database is configured or not. Best regards
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Forum Post: RE: Creating Parts
True, however you can always add it to the database through Derive DataBase Part
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Forum Post: RE: Unified Search (M): Bad request Source for Samacsys
this seems to be an issue related to the service itself, not to the CDS installation. I had this reported in 17.4 too.
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Forum Post: RE: Creating Parts
Yes indeed, that can work if there is a suitable part and footprint within the existing DB so as to derive something new from. However if nothing exists like a totally new category then one would need a method to access the physical database directly through a front end such as CIP by way of an example. Best regards.
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Forum Post: RE: Calculate Propagation Delay APD+
Thank you very much! Unfortunately, there is a discrepancy between the propagation delays calculated manually and those obtained using APD+ in CMRG. Are there any documents that introduce delay calculation equations?
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