The pad size on the standard SOLDERMASK_TOP and SOLDERMASK_BOTTOM layers for Via and Pins will be enhanced based on the Backdrill Soldermask in the Padstack. This dynamic pad size change is done when a Via or Pin is marked as a Backdrill location. There will not be a separate Soldermask layer for Backdrills it will be combined with the standard Soldermask layers.Thanks to Mike for this :-)
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